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BZX84C3V9LT3 Datasheet (PDF) 1 Page - ON Semiconductor

Part number BZX84C3V9LT3
Description  3.9V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3
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Manufacturer  ON Semiconductor
Direct Link  http://www.onsemi.com/PowerSol...
Logo ON Semiconductor

BZX84C3V9LT3 Datasheet (HTML) 1 Page - ON Semiconductor

   
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BZX84BxxxLT1,
BZX84CxxxLT1 Series,
SZBZX84BxxxLT1G,
SZBZX84CxxxLT1G Series
Zener Voltage Regulators
225 mW SOT23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
225 mW Rating on FR4 or FR5 Board
Zener Breakdown Voltage Range 2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance Series Available (See Page 4)
AECQ101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
PbFree Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V0
MAXIMUM RATINGS
Rating
Symbol Max
Unit
Total Power Dissipation on FR5 Board,
(Note 1) @ TA = 25°C
Derated above 25°C
Thermal Resistance, JunctiontoAmbient
PD
RqJA
225
mW
1.8 mW/°C
556
°C/W
Total Power Dissipation on Alumina
Substrate, (Note 2) @ TA = 25°C
Derated above 25°C
Thermal Resistance, JunctiontoAmbient
PD
RqJA
300
mW
2.4 mW/°C
417
°C/W
Junction and Storage Temperature Range TJ, Tstg 65 to
°C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
© Semiconductor Components Industries, LLC, 2011
1
November, 2011 Rev. 14
http://onsemi.com
3
Cathode
1
Anode
MARKING DIAGRAM
3
1
2
SOT23
CASE 318
STYLE 8
xxx M G
G
1
xxx = Device Code
M
= Date Code*
G
= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
BZX84CxxxLT1
BZX84CxxxLT1G
SZBZX84xxxLT1G
BZX84CxxxLT3
BZX84CxxxLT3G
SZBZXCxxxLT3G
BZX84BxxxLT1
Package Shipping
SOT23 3000/Tape & Reel
SOT23 3000/Tape & Reel
(PbFree)
SOT23 3000/Tape & Reel
(PbFree)
SOT23
SOT23
(PbFree)
10,000/Tape &
Reel
10,000/Tape &
Reel
SOT23 10,000/Tape &
(PbFree)
Reel
SOT23 3000/Tape & Reel
BZX84BxxxLT1G
SOT23 3000 / Tape &
(PbFree)
Reel
SZBZX84BxxxLT1G SOT23 3000 / Tape &
(PbFree)
Reel
BZX84BxxxLT3
BZX84BxxxLT3G
SOT23
SOT23
(PbFree)
10,000 / Tape &
Reel
10,000/Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
BZX84C2V4LT1/D

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